Silicon Wafer Manufacturing Method

Dummy CZ-Si wafer 1 inch, thickness = 275 ± 25 µm, , 1-side polished, p-type TTV 10 µm, 1

Silicon wafer is a material used for producing semiconductors, which can be found in all types of electronic devices that improve the lives of

silicon wafer SIEGERT WAFER GmbH is also your reliable partner for coating, dicing and many other services in the wafer sector We have the capability to grind and polish

silicone gel We supply all kinds of Silicon Wafers Czochalski- or Float-Zone growth, P-Type or N-Type, etched or polished surfaces?